DESCRIPTION:

The KISS-LTS200 is an automated machine specifically intended for the hot solder dip lead tinning process, whereby aged components can be refurbished in preparation for re-qualification to "High Reliability" standards. The KISS-LTS200 is built using common designs and components from the ACE selective soldering products, including the KISS-ware OS. The KISS-LTS200 system has a central fluxing station with 2 solder pots, one to each side of the fluxing station. One solder pot is usually dedicated to flushing off the original coating (or plating) while the other solder pot is dedicated to the "virgin" alloy for the final coating.

PROCESS OVERVIEW:

The system works in conjunction with pallets that hold the components in a known position through the process. Under program control a pallet of components moves to the central flux station where the component leads are immersed to a specific depth. The pallet then moves to the first solder pot (scavenging pot) where the component leads are dipped into the solder alloy and "scrubbed" to remove the existing coating. The pallet returns to the flux station where the leads are once again fluxed then to the second solder pot for the final dip of fresh alloy creating a homogenous intermetalic coating. The pallet holder and pallets accept a wide variety of components such as axials, connectors, DIPs, QFPs and virtually all leaded devices making the system very versatile with minimal change over time.

When fitted with two "lead free" solder pots the KISS-LTS200 can be used to convert tin-lead plated components to RoHs compliance. In this process one pot is used to dissolve the original plating into the sacrificial alloy of the first pot. The component leads are re-fluxed followed by dipping into the second 2nd "virgin alloy" solder pot for the final lead-free coating.

It is easy to create and add programmable routines such as "agitate in the solder" to help remove the original coating. You can specify and control "withdrawal rate" from the final solder bath to increase the solder thickness. The capabilities of the KISS-LTS200 and other process lore available from ACE greatly enhance the quality of the final lead finish.